上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
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APH-1628-G-TAPH-1628-G-T |
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APH-0828-G-TAPH-0828-G-T |
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APH-1728-G-TAPH-1728-G-T |
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APH-0728-G-TAPH-0728-G-T |
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APH-1328-G-TAPH-1328-G-T |
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116-43-950-61-006000CONN IC SKT DBL |
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116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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110-93-318-61-801000CONN IC SKT DBL |
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110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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517-83-365-17-091111CONN SOCKET PGA 365POS GOLD |
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规格书 |
517 | Bulk | Active | PGA | 365 (17 x 17) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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APH-0426-G-RAPH-0426-G-R |
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APH-0526-G-RAPH-0526-G-R |
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APH-0926-G-RAPH-0926-G-R |
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APH-0626-G-RAPH-0626-G-R |
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APH-1626-G-RAPH-1626-G-R |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1126-G-RAPH-1126-G-R |
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APH-0726-G-RAPH-0726-G-R |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0826-G-RAPH-0826-G-R |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1326-G-RAPH-1326-G-R |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1826-G-RAPH-1826-G-R |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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38-0511-11CONN SOCKET SIP 38POS GOLD |
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规格书 |
511 | Bulk | Active | SIP | 38 (1 x 38) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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121-11-964-41-001000CONN IC SKT DBL |
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规格书 |
121 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
