图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
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111-43-628-61-001000CONN IC SKT DBL |
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111 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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111-93-328-61-001000CONN IC SKT DBL |
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111 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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111-93-428-61-001000CONN IC SKT DBL |
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111 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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111-93-628-61-001000CONN IC SKT DBL |
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111 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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36-6503-21CONN IC DIP SOCKET 36POS GOLD |
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![]() 规格书 |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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116-43-640-61-006000CONN IC SKT DBL |
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116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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612-11-952-41-001000SKT CARRIER SOLDRTL |
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![]() 规格书 |
612 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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APH-0524-G-TAPH-0524-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1124-G-TAPH-1124-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1624-G-TAPH-1624-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0724-G-TAPH-0724-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1824-G-TAPH-1824-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1324-G-TAPH-1324-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0824-G-TAPH-0824-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0224-G-TAPH-0224-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1724-G-TAPH-1724-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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323-93-164-41-001000SOCKET 3 LEVEL WRAPOST SIP 64POS |
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![]() 规格书 |
323 | Tube | Active | SIP | 64 (1 x 64) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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28-C300-31CONN IC DIP SOCKET 28POS GOLD |
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![]() 规格书 |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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121-11-952-41-001000CONN IC SKT DBL |
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![]() 规格书 |
121 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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510-93-132-14-071001PGA SOCK 132PIN 14X14 SOLDER TL |
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510 | Tube | Active | PGA | 132 (14 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |