IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    111-43-628-61-001000

    111-43-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-328-61-001000

    111-93-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-428-61-001000

    111-93-428-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-628-61-001000

    111-93-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-6503-21

    36-6503-21

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    0
    36-6503-21

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-640-61-006000

    116-43-640-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-952-41-001000

    612-11-952-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    612-11-952-41-001000

    规格书

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0524-G-T

    APH-0524-G-T

    APH-0524-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1124-G-T

    APH-1124-G-T

    APH-1124-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1624-G-T

    APH-1624-G-T

    APH-1624-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0724-G-T

    APH-0724-G-T

    APH-0724-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1824-G-T

    APH-1824-G-T

    APH-1824-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1324-G-T

    APH-1324-G-T

    APH-1324-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0824-G-T

    APH-0824-G-T

    APH-0824-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0224-G-T

    APH-0224-G-T

    APH-0224-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1724-G-T

    APH-1724-G-T

    APH-1724-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    323-93-164-41-001000

    323-93-164-41-001000

    SOCKET 3 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    0
    323-93-164-41-001000

    规格书

    323 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-C300-31

    28-C300-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    28-C300-31

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    121-11-952-41-001000

    121-11-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    121-11-952-41-001000

    规格书

    121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-132-14-071001

    510-93-132-14-071001

    PGA SOCK 132PIN 14X14 SOLDER TL

    Mill-Max Manufacturing Corp.

    0

    -

    510 Tube Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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