IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1422-G-T

    APH-1422-G-T

    APH-1422-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0922-G-T

    APH-0922-G-T

    APH-0922-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1922-G-T

    APH-1922-G-T

    APH-1922-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1122-G-T

    APH-1122-G-T

    APH-1122-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0322-G-T

    APH-0322-G-T

    APH-0322-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1322-G-T

    APH-1322-G-T

    APH-1322-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0722-G-T

    APH-0722-G-T

    APH-0722-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0222-G-T

    APH-0222-G-T

    APH-0222-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0822-G-T

    APH-0822-G-T

    APH-0822-G-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    1051420433

    1051420433

    CONN SOCKET LGA 2011POS GOLD

    Molex

    0
    1051420433

    规格书

    105142 Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Thermoplastic -
    28-6508-211

    28-6508-211

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    28-6508-211

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6508-311

    28-6508-311

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    28-6508-311

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-43-432-61-105000

    110-43-432-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-308-61-105000

    110-43-308-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-316-61-605000

    110-43-316-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-316-61-605000

    110-93-316-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-085-11-041001

    510-93-085-11-041001

    CONN SOCKET PGA 85POS GOLD

    Mill-Max Manufacturing Corp.

    0
    510-93-085-11-041001

    规格书

    510 Tube Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1816-G-R

    APH-1816-G-R

    APH-1816-G-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0616-G-R

    APH-0616-G-R

    APH-0616-G-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0216-G-R

    APH-0216-G-R

    APH-0216-G-R

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
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