IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    517-83-280-18-101111

    517-83-280-18-101111

    CONN SOCKET PGA 280POS GOLD

    Preci-Dip

    0
    517-83-280-18-101111

    规格书

    517 Bulk Active PGA 280 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-1414-G-H

    APH-1414-G-H

    APH-1414-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0514-G-H

    APH-0514-G-H

    APH-0514-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0614-G-H

    APH-0614-G-H

    APH-0614-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0714-G-H

    APH-0714-G-H

    APH-0714-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1614-G-H

    APH-1614-G-H

    APH-1614-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0314-G-H

    APH-0314-G-H

    APH-0314-G-H

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    122-13-318-41-801000

    122-13-318-41-801000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    0
    122-13-318-41-801000

    规格书

    122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-650-41-001000

    123-91-650-41-001000

    SOCKET IC OPEN 3 LVL .600 50POS

    Mill-Max Manufacturing Corp.

    0

    -

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-650-41-001000

    123-41-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    123-41-650-41-001000

    规格书

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-328-41-001000

    612-13-328-41-001000

    SOCKET CARRIER SLDRTL .300 28POS

    Mill-Max Manufacturing Corp.

    0
    612-13-328-41-001000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-428-41-001000

    612-13-428-41-001000

    SOCKET CARRIER SLDRTL .400 28POS

    Mill-Max Manufacturing Corp.

    0
    612-13-428-41-001000

    规格书

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-628-41-001000

    612-13-628-41-001000

    SOCKET CARRIER SLDRTL .600 28POS

    Mill-Max Manufacturing Corp.

    0
    612-13-628-41-001000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-61-006000

    116-43-210-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-210-61-006000

    116-93-210-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0

    -

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    64-9518-10TE

    64-9518-10TE

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    0
    64-9518-10TE

    规格书

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-43-432-41-004000

    612-43-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    612-43-432-41-004000

    规格书

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-632-41-004000

    612-43-632-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    612-43-632-41-004000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-432-41-004000

    612-93-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    612-93-432-41-004000

    规格书

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-632-41-004000

    612-93-632-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    612-93-632-41-004000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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