上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICM-308-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 8P Adam Tech |
2,929 |
|
规格书 |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
ICM-314-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 14P Adam Tech |
1,458 |
|
规格书 |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
ICM-316-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 16P Adam Tech |
2,836 |
|
规格书 |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
PLCC-44-AT-SMTPLCC SOCKET 44P SMT Adam Tech |
2,286 |
|
规格书 |
PLCC | Tube | Active | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Thermoplastic | -55°C ~ 105°C |
|
ICM-318-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 18P Adam Tech |
2,175 |
|
规格书 |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
ICM-624-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 24P Adam Tech |
1,631 |
|
规格书 |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
ICM-320-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 20P Adam Tech |
633 |
|
规格书 |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
PLCC-20-ATPLCC 20P THROUGH HOLE Adam Tech |
3,380 |
|
规格书 |
PLCC | Tube | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
PLCC-44-ATPLCC 44P THROUGH HOLE Adam Tech |
858 |
|
规格书 |
PLCC | Tube | Active | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
PLCC-32-ATPLCC 32P THROUGH HOLE Adam Tech |
696 |
|
规格书 |
PLCC | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
