上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A22-LC-TRCONN IC DIP SOCKET 22POS TIN Assmann WSW Components |
0 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
|
AR 10-HZL-TTCONN IC DIP SOCKET 10POS GOLD Assmann WSW Components |
0 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AW 127-08/Z-TSOCKET 8 CONTACTS SINGLE ROW Assmann WSW Components |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
AR08-HZL-TTCONN IC DIP SOCKET 8POS TIN Assmann WSW Components |
0 |
|
规格书 |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
AW 127-04/Z-TSOCKET 4 CONTACTS SINGLE ROW Assmann WSW Components |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AW 127-09/Z-TSOCKET 9 CONTACTS SINGLE ROW Assmann WSW Components |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AR 06 HGL-TTSOCKET Assmann WSW Components |
0 |
|
规格书 |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AR06-HZL/01-TTCONN IC DIP SOCKET 6POS GOLD Assmann WSW Components |
0 |
|
规格书 |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
AW 127-11/Z-TSOCKET 11 CONTACTS SINGLE ROW Assmann WSW Components |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AW 127-12/Z-TSOCKET 12 CONTACTS SINGLE ROW Assmann WSW Components |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
