上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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A-ICS-254-14-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
0 |
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规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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AR 50-HZL/01-TTSOCKET Assmann WSW Components |
0 |
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- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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AR48-HZL/01-TTCONN IC DIP SOCKET 48POS GOLD Assmann WSW Components |
0 |
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规格书 |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
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AR 32-HZL/07-TTCONN IC DIP SOCKET 32POS GOLD Assmann WSW Components |
0 |
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规格书 |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
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AW-127A-20-ZCONN SOCKET SIP 20POS TIN Assmann WSW Components |
0 |
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规格书 |
- | - | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | - | Through Hole | Closed Frame | - | - | - | - | - | - | - |
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AR 52-HZL/01-TTSOCKET Assmann WSW Components |
0 |
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- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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AR 64-HZL-TTCONN IC DIP SOCKET 64POS TIN Assmann WSW Components |
0 |
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规格书 |
- | Tray | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
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AR 24-HZL/07/7-TTCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
0 |
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规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
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A-CCS84-GCONN SOCKET PLCC 84POS GOLD Assmann WSW Components |
0 |
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规格书 |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
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AR40-HZW/TCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
0 |
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规格书 |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
