上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
25-7XXXX-10CONN SOCKET SIP 25POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
33-7XXXX-10CONN SOCKET SIP 33POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 33 (1 x 33) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
35-7XXXX-10CONN SOCKET SIP 35POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 35 (1 x 35) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
1109011SERIES 513 LO-PRO W/SOLDER TAIL Aries Electronics |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
4236-118-14518 OPN FRM COLLET SCKT SLDR TAI Aries Electronics |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
2357-108-12EJECT-A-DP LCK/EJCT SCKT SLDR TL Aries Electronics |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
34-6823-90CONN IC DIP SOCKET 34POS GOLD Aries Electronics |
0 |
|
规格书 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
1109785800 VERTISOCKET HORIZONTAL MOUNT Aries Electronics |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
14-8470-10CONN IC DIP SOCKET 14POS TIN Aries Electronics |
0 |
|
规格书 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
10-28440-10CONN IC DIP SOCKET 10POS TIN Aries Electronics |
0 |
|
规格书 |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
