上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
26-0501-30CONN SOCKET SIP 26POS TIN Aries Electronics |
0 |
|
规格书 |
501 | Bulk | Active | SIP | 26 (1 x 26) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
40-3513-11HCONN IC DIP SOCKET 40POS GOLD Aries Electronics |
0 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
3883-312-10-32SER 6556 UNIV TEST SCKT RECEP Aries Electronics |
0 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
16-0511-11CONN SOCKET SIP 16POS GOLD Aries Electronics |
0 |
|
规格书 |
511 | Bulk | Active | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
25-7350-10CONN SOCKET SIP 25POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
25-7390-10CONN SOCKET SIP 25POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
25-7435-10CONN SOCKET SIP 25POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
25-7450-10CONN SOCKET SIP 25POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
25-7500-10CONN SOCKET SIP 25POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
25-7590-10CONN SOCKET SIP 25POS TIN Aries Electronics |
0 |
|
规格书 |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
