IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    24-3518-112

    24-3518-112

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    24-3518-112

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-6518-112

    24-6518-112

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    24-6518-112

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-6810-90T

    12-6810-90T

    CONN IC DIP SOCKET 12POS TIN

    Aries Electronics

    0
    12-6810-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    09-71000-10

    09-71000-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    0
    09-71000-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7325-10

    09-7325-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    0
    09-7325-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7350-10

    09-7350-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    0
    09-7350-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7375-10

    09-7375-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    0
    09-7375-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7380-10

    09-7380-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    0
    09-7380-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7420-10

    09-7420-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    0
    09-7420-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7450-10

    09-7450-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    0
    09-7450-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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