上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1554116-3CONN SOCKET LGA 1356POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Tray | Obsolete | LGA | 1356 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
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1761122-1POWER ASSY TE Connectivity AMP Connectors |
0 |
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规格书 |
- | Bulk | Active | LGA | 145 | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic, Glass Filled | - |
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1939737-1CONN SOCKET LGA 1366POS TE Connectivity AMP Connectors |
0 |
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- |
- | Tray | Obsolete | LGA | 1366 (32 x 41) | - | - | - | - | - | - | - | - | - | - | - | - | - |
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8059-2G2CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
8059 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
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5-1437530-2CONN IC SIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
500 | Tube | Obsolete | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | - | Brass | Polyester | -55°C ~ 125°C |
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528-AG11DCONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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808-AG12DCONN IC DIP SOCKET 8POS TIN-LEAD TE Connectivity AMP Connectors |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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506-AG11D-ESCONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
0 |
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- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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2-382468-4CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic | -55°C ~ 125°C |
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2-382712-1CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
