上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2485267-1DIP IC SOCKET 6P,GOLD FLASH-SMD TE Connectivity AMP Connectors |
5,400 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2485267-2DIP IC SOCKET 8P,GOLD FLASH-SMD TE Connectivity AMP Connectors |
5,397 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2485267-3DIP IC SOCKET 10P,GOLD FLASH-SMD TE Connectivity AMP Connectors |
5,400 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2485267-4DIP IC SOCKET 12P,GOLD FLASH-SMD TE Connectivity AMP Connectors |
5,399 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2445893-1DIP IC SOCKET 8P SMT TE Connectivity AMP Connectors |
4,500 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2444090-1CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
- | Bulk | Active | SIP | 10 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | - |
|
|
2485264-5DIP IC SOCKET 18P,SN TE Connectivity AMP Connectors |
5,720 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2485264-2DIP IC SOCKET 14P-SN TE Connectivity AMP Connectors |
7,641 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2444090-4SIP IC SKT 20 AU0.75 TE Connectivity AMP Connectors |
0 |
|
规格书 |
- | Tray | Active | SIP | 20 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2485264-6DIP IC SOCKET 20P,SN TE Connectivity AMP Connectors |
5,228 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
