上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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643662-1CONN SOCKET SIP 30POS TIN TE Connectivity AMP Connectors |
0 |
|
规格书 |
Diplomate DL | Tray | Obsolete | SIP | 30 (1 x 30) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
510-AG90D-20CONN SOCKET SIP 20POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic | - |
|
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528-AG12D-ES-LFCONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
4-1437531-5CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
192 |
|
规格书 |
500 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
|
514-AG10DCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
|
2-1571550-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
540-AG10D-ESCONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
|
|
7-1437536-3540-AG10D-ES=SOCKET ASSY TE Connectivity AMP Connectors |
4,246 |
|
规格书 |
* | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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820-AG10DCONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
506-AG10DCONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
0 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Brass | - | -55°C ~ 125°C |
