IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-87-422-31-012101

    614-87-422-31-012101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    614-87-422-31-012101

    规格书

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-308-41-013101

    116-87-308-41-013101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    116-87-308-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0502-T-T

    APH-0502-T-T

    APH-0502-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1002-T-T

    APH-1002-T-T

    APH-1002-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1502-T-T

    APH-1502-T-T

    APH-1502-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1902-T-T

    APH-1902-T-T

    APH-1902-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0602-T-T

    APH-0602-T-T

    APH-0602-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1102-T-T

    APH-1102-T-T

    APH-1102-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1602-T-T

    APH-1602-T-T

    APH-1602-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0202-T-T

    APH-0202-T-T

    APH-0202-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0302-T-T

    APH-0302-T-T

    APH-0302-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0702-T-T

    APH-0702-T-T

    APH-0702-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0402-T-T

    APH-0402-T-T

    APH-0402-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1802-T-T

    APH-1802-T-T

    APH-1802-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1302-T-T

    APH-1302-T-T

    APH-1302-T-T

    Samtec Inc.

    0

    -

    * - Active - - - - - - - - - - - - - - -
    614-83-420-41-001101

    614-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    614-83-420-41-001101

    规格书

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-320-41-001101

    614-83-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    614-83-320-41-001101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-324-41-003101

    116-87-324-41-003101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    116-87-324-41-003101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-316-41-105191

    110-83-316-41-105191

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0

    -

    110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-312-41-001101

    116-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    116-83-312-41-001101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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