上传BOM
IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SIP1X17-001BSIP1X17-001B-SIP SOCKET 17 CTS |
0 |
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规格书 |
SIP1x | Bulk | Active | SIP | 17 (1 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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04-0513-11CONN SOCKET SIP 4POS GOLD |
0 |
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规格书 |
0513 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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2-382714-1CONN IC DIP SOCKET 20POS TIN |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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1051631001SMIA65 CAMERA SOCKET CONTACT |
0 |
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规格书 |
105163 | Tape & Reel (TR) | Obsolete | Camera Socket | 12 (2 x 6) | 0.037" (0.95mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount, Through Board | Open Frame | Solder | 0.037" (0.95mm) | Gold | Flash | Copper Alloy | Thermoplastic | -55°C ~ 85°C |
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1051900001TOP-MOUNT CAMERA SOCKET FOR SMIA |
0 |
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规格书 |
105190 | Tape & Reel (TR) | Obsolete | Camera Socket | 12 (2 x 6) | 0.033" (0.85mm) | Gold | 12.0µin (0.30µm) | Phosphor Bronze Alloy | Surface Mount | Open Frame | Solder | 0.033" (0.85mm) | Gold | Flash | Phosphor Bronze Alloy | Thermoplastic | -55°C ~ 85°C |
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540-88-032-17-400CONN SOCKET PLCC 32POS TIN |
0 |
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规格书 |
540 | Bulk | Active | PLCC | 32 (4 x 8) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | - |
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808-AG11D-ESL-LFCONN IC DIP SOCKET 8POS GOLD |
0 |
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规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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116-83-306-41-007101CONN IC DIP SOCKET 6POS GOLD |
0 |
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规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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115-87-316-41-003101CONN IC DIP SOCKET 16POS GOLD |
0 |
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规格书 |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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AR 24 HGL-TTSOCKET |
0 |
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- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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AR 24 HGL/7-TTSOCKET |
0 |
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- |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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110-87-320-41-005101CONN IC DIP SOCKET 20POS GOLD |
0 |
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规格书 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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110-87-320-41-605101CONN IC DIP SOCKET 20POS GOLD |
0 |
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规格书 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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233-84CONN SOCKET PLCC 84POS TIN |
0 |
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规格书 |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
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3-382568-2CONN IC DIP SOCKET 32POS TIN |
0 |
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规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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614-83-308-31-012101CONN IC DIP SOCKET 8POS GOLD |
0 |
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规格书 |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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114-83-308-41-134191CONN IC DIP SOCKET 8POS GOLD |
0 |
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规格书 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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A22-LCG-T-RCONN IC DIP SOCKET 22POS GOLD |
0 |
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规格书 |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
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SIP050-1X10-160B1X10-160B-SIP SOCKET 10 CTS |
0 |
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规格书 |
SIP050-1x | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
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SU1210200000GSU-2*6P RED ; 10.0MM CLIP PLATI |
0 |
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- |
SU | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
