IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    06-1518-10H

    06-1518-10H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    0
    06-1518-10H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0517-90C

    02-0517-90C

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    0
    02-0517-90C

    规格书

    0517 Bulk Active SIP 2 (1 x 2) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0102-T-10

    HLS-0102-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    HLS-0102-T-10

    规格书

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    DIP624-011B

    DIP624-011B

    DIP624-011B-DIP SOCKET 24 CTS

    Amphenol ICC (FCI)

    0
    DIP624-011B

    规格书

    - Bag Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    130-028-000

    130-028-000

    CONN IC DIP SOCKET 28POS GOLD

    3M

    0

    -

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    110-87-310-41-105161

    110-87-310-41-105161

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    110-87-310-41-105161

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AJ 42-LC

    AJ 42-LC

    SOCKET

    Assmann WSW Components

    0

    -

    - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    116-87-310-41-006101

    116-87-310-41-006101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    116-87-310-41-006101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-306-41-134191

    114-83-306-41-134191

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    114-83-306-41-134191

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    WMS-2810Z

    WMS-2810Z

    CONN IC DIP SOCKET 28POS GOLD

    On Shore Technology Inc.

    0
    WMS-2810Z

    规格书

    WMS Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    AR 10-HZL/07-TT

    AR 10-HZL/07-TT

    IC SOCKET 10 PIN MACH CONT

    Assmann WSW Components

    0
    AR 10-HZL/07-TT

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    A-CCS32-G

    A-CCS32-G

    CONN SOCKET PLCC 32POS GOLD

    Assmann WSW Components

    0
    A-CCS32-G

    规格书

    - Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    612-87-610-41-001101

    612-87-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    612-87-610-41-001101

    规格书

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0518-11

    05-0518-11

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    0
    05-0518-11

    规格书

    518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AW 127-37/Z-T

    AW 127-37/Z-T

    SOCKET 37 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    AW 127-37/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    A-CCS52-Z-SM-R

    A-CCS52-Z-SM-R

    CONN SOCKET PLCC 52POS TIN

    Assmann WSW Components

    0
    A-CCS52-Z-SM-R

    规格书

    - Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    116-87-308-41-012101

    116-87-308-41-012101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    116-87-308-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HGL/7-TT

    AR 22-HGL/7-TT

    SOCKET

    Assmann WSW Components

    0

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Brass Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    HLS-0102-T-11

    HLS-0102-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    HLS-0102-T-11

    规格书

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-83-012-05-001101

    510-83-012-05-001101

    CONN SOCKET PGA 12POS GOLD

    Preci-Dip

    0
    510-83-012-05-001101

    规格书

    510 Bulk Active PGA 12 (5 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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