RFI 和 EMI - 接触件、弹性条和垫圈

    制造商 系列 包装 产品状态 类型 形状 宽度 长度 高度 材质 电镀 电镀 - 厚度 附件方式 工作温度





























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 形状 宽度 长度 高度 材质 电镀 电镀 - 厚度 附件方式 工作温度
    4912PA51H00100

    4912PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    0

    -

    51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 1.000" (25.40mm) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    67BCG2504303510R00

    67BCG2504303510R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    0
    67BCG2504303510R00

    规格书

    BCG Bulk Active Fingerstock - 0.098" (2.50mm) 0.169" (4.30mm) 0.138" (3.50mm) Beryllium Copper Gold - Solder -
    4157PA51H00100

    4157PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    0

    -

    ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.787" (20.00mm) 1.000" (25.40mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    67BCG2003201508R00

    67BCG2003201508R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    0
    67BCG2003201508R00

    规格书

    BCG Bulk Active Fingerstock - 0.078" (2.00mm) 0.126" (3.20mm) 0.059" (1.50mm) Beryllium Copper Gold - Solder -
    67B5N4004005108R00

    67B5N4004005108R00

    SP,CON,TNR 5.10X4.00X4.00MM

    Laird Technologies EMI

    0

    -

    - Cut Tape (CT) Active - - - - - - - - - -
    4788PB51H00100

    4788PB51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    0
    4788PB51H00100

    规格书

    ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.250" (6.35mm) 1.000" (25.40mm) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    67SLG040040025PI00

    67SLG040040025PI00

    RFI FILM OVER FOAM PU SOLDER

    Laird Technologies EMI

    0
    67SLG040040025PI00

    规格书

    SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.157" (4.00mm) 0.098" (2.50mm) 0.157" (4.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
    4084AA51K00100

    4084AA51K00100

    RFI FOF GASKET PU

    Laird Technologies EMI

    0
    4084AA51K00100

    规格书

    51K Bulk Active Fabric Over Foam Square 0.500" (12.70mm) 1.000" (25.40mm) 0.500" (12.70mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
    4692PA51G00200

    4692PA51G00200

    RFI FOF GASKET ADH

    Laird Technologies EMI

    0
    4692PA51G00200

    规格书

    51G Bulk Active Fabric Over Foam D-Shape 0.252" (6.40mm) 2.000" (50.80mm) 0.142" (3.60mm) - - - Adhesive -
    67B7G2504005010R00

    67B7G2504005010R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    0
    67B7G2504005010R00

    规格书

    - Bulk Active Fingerstock - 0.098" (2.50mm) 0.157" (4.00mm) 0.197" (5.00mm) Beryllium Copper Gold - Solder -
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