图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 样式 | 位置数量 | 已加载位置数 | 配对间距 | 行数 | 行间距 - 配对 | 安装类型 | 端接方式 | 固定类型 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 绝缘颜色 | 绝缘高度 | 触点长度 - 引脚部分 | 工作温度 | 材料阻燃等级 | 配对堆叠高度 | 防护等级 | 特性 | 电流额定值(安培) |
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YTE-150-02-G-Q-7002.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
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![]() 规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.700" (17.78mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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YTE-150-02-G-Q-3752.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
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![]() 规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.375" (9.53mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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YTE-150-02-G-5-7502.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
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![]() 规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 250 | All | 0.079" (2.00mm) | 5 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.750" (19.05mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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YTE-150-02-G-5-7202.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
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![]() 规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 250 | All | 0.079" (2.00mm) | 5 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.720" (18.30mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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YTE-135-02-G-6-3752.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
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![]() 规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 210 | All | 0.079" (2.00mm) | 6 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.375" (9.53mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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YTQ-148-03-S-62.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
0 |
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![]() 规格书 |
YTQ | Tube | Active | Socket | Forked | Board to Board | 288 | All | 0.079" (2.00mm) | 6 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.250" (6.35mm) | 0.208" (5.28mm) | -55°C ~ 125°C | - | - | - | - | - |
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YTE-150-03-G-6-3752.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
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![]() 规格书 |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 300 | All | 0.079" (2.00mm) | 6 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.375" (9.53mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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SFMX-115-T2-S-DCONN RCPT 30POS 0.05 GOLD SMD Samtec Inc. |
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![]() 规格书 |
Tiger Eye™ SFMX | Tube | Active | Receptacle | Female Socket | Board to Board | 30 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Locking Ramp | Gold | 30.0µin (0.76µm) | Black | 0.180" (4.57mm) | - | -55°C ~ 125°C | - | - | - | Board Lock | - |
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BCS-122-L-S-TE-013CONN RCPT 22POS 0.1 GOLD PCB Samtec Inc. |
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![]() 规格书 |
Tiger Claw™ BCS | Tube | Active | Receptacle | Female Socket | Board to Board | 22 | 21 | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.290" (7.37mm) | 0.122" (3.10mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.6A per Contact |
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BCS-122-L-S-TE-022CONN RCPT 22POS 0.1 GOLD PCB Samtec Inc. |
0 |
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![]() 规格书 |
Tiger Claw™ BCS | Tube | Active | Receptacle | Female Socket | Board to Board | 22 | 21 | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.290" (7.37mm) | 0.122" (3.10mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.6A per Contact |