电源管理 - 专用

    制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
    MC33VR5500V3ESR2

    MC33VR5500V3ESR2

    VR5500

    NXP USA Inc.

    0

    -

    * - Tape & Reel (TR) Active - - - - - - - -
    MC33VR5500V2ESR2

    MC33VR5500V2ESR2

    VR5500

    NXP USA Inc.

    0

    -

    * - Tape & Reel (TR) Active - - - - - - - -
    MC33VR5500V1ESR2

    MC33VR5500V1ESR2

    VR5500

    NXP USA Inc.

    0
    MC33VR5500V1ESR2

    规格书

    * - Tape & Reel (TR) Active - - - - - - - -
    MC33VR5500V0ESR2

    MC33VR5500V0ESR2

    VR5500

    NXP USA Inc.

    0
    MC33VR5500V0ESR2

    规格书

    * - Tape & Reel (TR) Active - - - - - - - -
    UC29432DTRG4

    UC29432DTRG4

    IC ANLG CTRLR ADJ 8SOIC

    Texas Instruments

    0
    UC29432DTRG4

    规格书

    - 8-SOIC (0.154", 3.90mm Width) Tape & Reel (TR) Discontinued at Digi-Key Overvoltage Comparator, Optocoupler 500µA 2.2V ~ 24V -25°C ~ 85°C - - Surface Mount 8-SOIC
    MC35FS6506NAE

    MC35FS6506NAE

    SYSTEM BASIS CHIP, DCDC 0.8A VCO

    NXP USA Inc.

    0
    MC35FS6506NAE

    规格书

    - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC35FS4501NAE

    MC35FS4501NAE

    FS4500

    NXP USA Inc.

    0
    MC35FS4501NAE

    规格书

    - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    LTC3331IUH#TRPBF

    LTC3331IUH#TRPBF

    IC REG BUCK/LDO SYNC 50MA 32QFN

    Analog Devices Inc.

    0
    LTC3331IUH#TRPBF

    规格书

    - 32-WFQFN Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 1.8V ~ 5.5V, 3V ~ 19V -40°C ~ 125°C - - Surface Mount 32-QFN (5x5)
    MVR5510AVMA6EPR2

    MVR5510AVMA6EPR2

    IC PMIC VR5510 QM

    NXP USA Inc.

    0

    -

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MVR5510AVMA0EPR2

    MVR5510AVMA0EPR2

    IC PMIC VR5510 QM

    NXP USA Inc.

    0

    -

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MVR5510AVMA4EPR2

    MVR5510AVMA4EPR2

    IC PMIC VR5510 QM

    NXP USA Inc.

    0

    -

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MVR5510AVMAHEPR2

    MVR5510AVMAHEPR2

    IC PMIC VR5510 QM

    NXP USA Inc.

    0

    -

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100CCESR2

    MC33PF8100CCESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8100CCESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100EPESR2

    MC33PF8100EPESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8100EPESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100CFESR2

    MC33PF8100CFESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8100CFESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100EQESR2

    MC33PF8100EQESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8100EQESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100EAESR2

    MC33PF8100EAESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8100EAESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100ERESR2

    MC33PF8100ERESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8100ERESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100CHESR2

    MC33PF8100CHESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8100CHESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8100A0ESR2

    MC33PF8100A0ESR2

    POWER MANAGEMENT IC I.MX8 NON-PR

    NXP USA Inc.

    0
    MC33PF8100A0ESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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