图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
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MVR5510AVMA4EPR2IC PMIC VR5510 QM NXP USA Inc. |
0 |
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- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MVR5510AVMAHEPR2IC PMIC VR5510 QM NXP USA Inc. |
0 |
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- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100CCESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100EPESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100CFESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100EQESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100EAESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8100ERESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100CHESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
0 |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |