图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
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MC33PF3000A3ESR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
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![]() 规格书 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33PF3000A4ESR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
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![]() 规格书 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33PF3000A5ESR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
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![]() 规格书 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33PF3000A6ESR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
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![]() 规格书 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33PF3000A7ESR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
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![]() 规格书 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC34PF1510A1EPR2PF1510 NXP USA Inc. |
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![]() 规格书 |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MFS8622BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
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- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
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MC33FS6515LAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
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![]() 规格书 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6516NAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
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![]() 规格书 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4507KAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
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![]() 规格书 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |