图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
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MFS2301BMBA0EPMFS2301BMBA0EP NXP USA Inc. |
0 |
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![]() 规格书 |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
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MC34912BACIC SYSTEM BASIS CHIP LIN 32-LQFP NXP USA Inc. |
0 |
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![]() 规格书 |
- | 32-LQFP | Tray | Active | System Basis Chip | 4.5mA | 5.5V ~ 18V | -40°C ~ 85°C | - | - | Surface Mount | 32-LQFP (7x7) |
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MFS2321BMBA0EPR2MFS2321BMBA0EPR2 NXP USA Inc. |
0 |
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![]() 规格书 |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
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MFS2321BMBB2EPR2MFS2321BMBB2EPR2 NXP USA Inc. |
0 |
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![]() 规格书 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 5.5V ~ 40V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MFS2302BMBA0EPR2MFS2302BMBA0EPR2 NXP USA Inc. |
0 |
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![]() 规格书 |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
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MFS2322BMMA0EPR2MFS2322BMMA0EPR2 NXP USA Inc. |
0 |
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![]() 规格书 |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
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MFS2321BMMA0EPMFS2321BMMA0EP NXP USA Inc. |
0 |
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![]() 规格书 |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
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MFS2302BMMA0EPMFS2302BMMA0EP NXP USA Inc. |
0 |
|
![]() 规格书 |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
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MFS2324BMBA0EPMFS2324BMBA0EP NXP USA Inc. |
0 |
|
![]() 规格书 |
- | 48-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | 3.3V, 5V | -40°C ~ 120°C | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC34PF3001A6EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
0 |
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![]() 规格书 |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) |