图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
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MC33FS6600M2ESR2SAFETY SBC FOR S32S2 MCU NXP USA Inc. |
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- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Safety | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200CXESIC POWER MANAGEMENT LS1043A NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200D2ESIC POWER MANAGEMENT NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DBESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DFESI.MX8QXP WITH DDR3L NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DHESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ESESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ETESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DMESPOWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DNESPOWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
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![]() 规格书 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |