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    全部重置
    应用所有
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    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
    MC33PF8100ERES

    MC33PF8100ERES

    IC POWER MANAGEMENT I.MX8QM

    NXP USA Inc.

    0
    MC33PF8100ERES

    规格书

    - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC35FS4503NAER2

    MC35FS4503NAER2

    FS4500

    NXP USA Inc.

    0
    MC35FS4503NAER2

    规格书

    - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC33FS8435G0ESR2

    MC33FS8435G0ESR2

    SAFETY POWER MANAGEMENT IC, QFN5

    NXP USA Inc.

    0
    MC33FS8435G0ESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33FS8435G0KSR2

    MC33FS8435G0KSR2

    SAFETY POWER MANAGEMENT IC, QFN5

    NXP USA Inc.

    0
    MC33FS8435G0KSR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC35FS6512NAE

    MC35FS6512NAE

    FS6500

    NXP USA Inc.

    0
    MC35FS6512NAE

    规格书

    - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC35FS4507CAE

    MC35FS4507CAE

    SYSTEM BASIS CHIP, LINEAR 0.5A V

    NXP USA Inc.

    0
    MC35FS4507CAE

    规格书

    - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC33FS8430G2ES

    MC33FS8430G2ES

    SYSTEM BASIS CHIP FS8430

    NXP USA Inc.

    0

    -

    * - Tray Active - - - - - - - -
    MC33FS8430G4ES

    MC33FS8430G4ES

    SYSTEM BASIS CHIP FS8430

    NXP USA Inc.

    0

    -

    * - Tray Active - - - - - - - -
    MC33PF8200DEESR2

    MC33PF8200DEESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8200DEESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200D2ESR2

    MC33PF8200D2ESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    0
    MC33PF8200D2ESR2

    规格书

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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