上传BOM
振荡器
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 基谐振器 | 类型 | 频率 | 功能 | 输出 | 电压 - 电源 | 频率稳定性 | 绝对拉力范围（APR） | 工作温度 | 扩展频谱带宽 | 电流 - 电源（最大值） | 额定值 | 安装类型 | 供应商设备封装 | 尺寸 / 尺寸 | 高度 - 安装后（最大值） |
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DSC6111BI2B-033.3330MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VDFN | Tube | Active | MEMS | XO (Standard) | 33.333 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VDFN (5x3.2) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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DSC6111BI2B-025.0000MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VDFN | Tube | Active | MEMS | XO (Standard) | 25 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VDFN (5x3.2) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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DSC6111BI2B-050.0000MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VDFN | Tube | Active | MEMS | XO (Standard) | 50 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VDFN (5x3.2) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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DSC6111HI1B-033.3330TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 33.333 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6111HI1B-019.2000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 19.2 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6111HI1B-016.0000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 16 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6111HI1B-012.2880TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 12.288 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6111BI2B-024.0000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VDFN (5x3.2) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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DSC6111BI2B-012.2880TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 12.288 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VDFN (5x3.2) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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DSC6111BI2B-006.0000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 6 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 4-VDFN (5x3.2) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
