上传BOM
振荡器
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 基谐振器 | 类型 | 频率 | 功能 | 输出 | 电压 - 电源 | 频率稳定性 | 绝对拉力范围（APR） | 工作温度 | 扩展频谱带宽 | 电流 - 电源（最大值） | 额定值 | 安装类型 | 供应商设备封装 | 尺寸 / 尺寸 | 高度 - 安装后（最大值） |
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DSC6001HI2B-005.0000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 5 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6001HI2B-002.0800MEMS OSCILLATOR, ULTRA LOW POWER Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 2.08 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC1525MI2A-33M33333MEMS OSC, LOW JITTER, 33.33333MH Microchip Technology |
0 |
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规格书 |
DSC152X | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 33.33333 MHz | Enable/Disable | LVCMOS | 1.8V | ±25ppm | - | -40°C ~ 85°C | - | 7.5mA | - | Surface Mount | - | 0.079" L x 0.063" W (2.00mm x 1.60mm) | 0.035" (0.89mm) |
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090-02789-011SA65 COMMERCIAL NON ROHS Microchip Technology |
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CSAC SA65 | 12-DIP Module, 9 Leads | Bulk | Active | Crystal | Atomic | 10 MHz | - | CMOS | 3.3V | ±0.3ppb | - | -10°C ~ 65°C | - | - | - | Through Hole | 4-VDFN (3.2x2.5) | 1.600" L x 1.390" W (40.64mm x 35.31mm) | 0.460" (11.68mm) |
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DSC6011HI2B-050.0000MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 50 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSA6331ML1AB-025.0000VAOSPREAD SPECTRUM OSC. FOR AUTO., Microchip Technology |
0 |
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DSA63XX | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 25 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 105°C | ±0.25%, Center Spread | 3mA (Typ) | AEC-Q100 | Surface Mount | - | 0.079" L x 0.063" W (2.00mm x 1.60mm) | 0.035" (0.89mm) |
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DSC6013HI2B-024.0000MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6111HI2B-033.3300MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
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规格书 |
DSC61XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 33.33 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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090-02789-012SA65 INDUSTRIAL NON ROHS Microchip Technology |
0 |
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CSAC SA65 | 12-DIP Module, 9 Leads | Bulk | Active | Crystal | Atomic | 10 MHz | - | CMOS | 3.3V | ±0.3ppb | - | -40°C ~ 85°C | - | - | - | Through Hole | 4-VDFN (3.2x2.5) | 1.600" L x 1.390" W (40.64mm x 35.31mm) | 0.460" (11.68mm) |
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DSC6101HA1B-025.0000MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 25 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
