上传BOM
振荡器
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 基谐振器 | 类型 | 频率 | 功能 | 输出 | 电压 - 电源 | 频率稳定性 | 绝对拉力范围（APR） | 工作温度 | 扩展频谱带宽 | 电流 - 电源（最大值） | 额定值 | 安装类型 | 供应商设备封装 | 尺寸 / 尺寸 | 高度 - 安装后（最大值） |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DSC6001HI2B-006.0000MEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 6 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6011HE1B-084K000MEMS OSC ULP LVCMOS -20C-70C 50P Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 84 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -20°C ~ 70°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6011HE1B-084K000TMEMS OSC ULP LVCMOS -20C-70C 50P Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 84 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -20°C ~ 70°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6011HI1B-024.0000MEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6013HE2B-084K000TMEMS OSC ULP LVCMOS -20C-70C 25P Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 84 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -20°C ~ 70°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6021HI3B-016RTMEMS OSC (FS) ULP LVCMOS -40C-85 Microchip Technology |
0 |
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规格书 |
DSC60XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 21 MHz | - | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6101HA3B-024.0000MEMS OSC ULP LVCMOS -40C-125C 20 Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 24 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6101HA3B-024.0000TMEMS OSC ULP LVCMOS -40C-125C 20 Microchip Technology |
0 |
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规格书 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 24 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6301HA1FB-020.0000SPREAD SPECTRUM MEMS OSC +-2.5% Microchip Technology |
0 |
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规格书 |
DSC63XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 20 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 125°C | ±2.50%, Center Spread | 3mA (Typ) | - | Surface Mount | 4-VDFN (3.2x2.5) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
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DSC6301HA1FB-020.0000BSPREAD SPECTRUM MEMS OSC +-2.5% Microchip Technology |
0 |
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规格书 |
DSC63XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 20 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 125°C | ±2.50%, Center Spread | 3mA (Typ) | - | Surface Mount | - | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
