传感器和探测器接口

    制造商 封装/外壳 系列 包装 产品状态 可编程 类型 输入类型 输出类型 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装



































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 封装/外壳 系列 包装 产品状态 可编程 类型 输入类型 输出类型 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
    ZSC31010CED

    ZSC31010CED

    DICE (WAFER SAWN) - WAFFLE PACK

    Renesas Electronics Corporation

    0
    ZSC31010CED

    规格书

    - * Tray Active Not Verified - - - - - - - - -
    ZSC31050FIB

    ZSC31050FIB

    WAFER (UNSAWN) - BOX

    Renesas Electronics Corporation

    0
    ZSC31050FIB

    规格书

    - * Tray Active Not Verified - - - - - - - - -
    ZSSC4169DE5T-APC

    ZSSC4169DE5T-APC

    TSSOP / 16 / 5X4MM-0

    Renesas Electronics Corporation

    0
    ZSSC4169DE5T-APC

    规格书

    24-VFQFN Exposed Pad - Tube Active - Signal Conditioner Differential 1-Wire® - -40°C ~ 150°C Automotive AEC-Q100 Surface Mount, Wettable Flank 24-QFN (4x4)
    ZSSC3281BI5B

    ZSSC3281BI5B

    DICE ON 304 MICRO METER WAFER WI

    Renesas Electronics Corporation

    0
    ZSSC3281BI5B

    规格书

    Die - Tray Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 15 mA -40°C ~ 125°C (TA) - - Surface Mount Die
    ZSSC3281BI2B

    ZSSC3281BI2B

    DICE ON 725 MICRO METER WAFER NO

    Renesas Electronics Corporation

    0
    ZSSC3281BI2B

    规格书

    Die - Tray Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 15 mA -40°C ~ 125°C (TA) - - Surface Mount Die
    ZSSC3281BI6B

    ZSSC3281BI6B

    DICE ON 725 MICRO METER WAFER WI

    Renesas Electronics Corporation

    0
    ZSSC3281BI6B

    规格书

    Die - Tray Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 15 mA -40°C ~ 125°C (TA) - - Surface Mount Die
    ZSSC3281BI1B

    ZSSC3281BI1B

    DICE ON 304 MICRO METER WAFER NO

    Renesas Electronics Corporation

    0
    ZSSC3281BI1B

    规格书

    Die - Tray Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 15 mA -40°C ~ 125°C (TA) - - Surface Mount Die
    ZSSC3281BC8R

    ZSSC3281BC8R

    SMART SENSOR -> BUMPED DIE

    Renesas Electronics Corporation

    0
    ZSSC3281BC8R

    规格书

    - - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 15 mA -40°C ~ 125°C (TA) - - - -
    ZSSC3281BI8R

    ZSSC3281BI8R

    SMART SENSOR -> BUMPED DIE

    Renesas Electronics Corporation

    0
    ZSSC3281BI8R

    规格书

    - - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 15 mA -40°C ~ 125°C (TA) - - - -
    ZSC31050FAB

    ZSC31050FAB

    WAFER (UNSAWN) - BOX

    Renesas Electronics Corporation

    0
    ZSC31050FAB

    规格书

    - * Tray Active Not Verified - - - - - - - - -
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