| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 平面软排线类型 | 安装类型 | 连接器/触点类型 | 位置数量 | 间距 | 端接方式 | FFC、FCB 厚度 | 板上高度 | 锁定特性 | 电缆端类型 | 触点材料 | 触点表面处理 | 外壳材料 | 执行器材料 | 特性 | 电压额定值 | 工作温度 | 材料阻燃等级 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
086222024101800+CONN FFC BOTTOM 24POS 0.5MM R/A |
0 |
|
规格书 |
6222, Kyocera | Tape & Reel (TR) | Obsolete | FFC, FPC | Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.077" (1.95mm) | - | Tapered | Copper Alloy | Tin Copper | Plastic | - | Low Insertion Force (LIF), Mating Flange, Solder Retention | 50V | -40°C ~ 85°C | - |
|
086222030101800+CONN FFC BOTTOM 30POS 0.5MM R/A |
0 |
|
规格书 |
6222, Kyocera | Tape & Reel (TR) | Obsolete | FFC, FPC | Surface Mount, Right Angle | Contacts, Bottom | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.077" (1.95mm) | - | Tapered | Copper Alloy | Tin Copper | Plastic | - | Low Insertion Force (LIF), Mating Flange, Solder Retention | 50V | -40°C ~ 85°C | - |
|
FA5B020HP1CONN FPC BOTTOM 20POS 0.5MM SMD |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Board Edge, Cutout | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5B030HP1CONN FPC BOTTOM 30POS 0.5MM SMD |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Board Edge, Cutout | Contacts, Bottom | 30 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5B050HP1CONN FPC BOTTOM 50POS 0.5MM SMD |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Board Edge, Cutout | Contacts, Bottom | 50 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S006HP1CONN FPC BOTTOM 6POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S010HP1CONN FPC BOTTOM 10POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S015HP1CONN FPC BOTTOM 15POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S018HP1CONN FPC BOTTOM 18POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S020HP1CONN FPC BOTTOM 20POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S026HP1CONN FPC BOTTOM 26POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S036HP1CONN FPC BOTTOM 36POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 36 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FA5S045HP1CONN FPC BOTTOM 45POS 0.5MM R/A |
0 |
|
规格书 |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FF02S40SV1CONN FPC BOTTOM 40POS 0.3MM R/A |
0 |
|
规格书 |
FF02S | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 40 | 0.012" (0.30mm) | Solder | 0.12mm | 0.035" (0.88mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FF02S45SV1CONN FPC BOTTOM 45POS 0.3MM R/A |
0 |
|
规格书 |
FF02S | Strip | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.012" (0.30mm) | Solder | 0.12mm | 0.035" (0.88mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
FF02S50SV1CONN FPC BOTTOM 50POS 0.3MM R/A |
0 |
|
规格书 |
FF02S | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 50 | 0.012" (0.30mm) | Solder | 0.12mm | 0.035" (0.88mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
IL-FPR-20S-VF-N1CONN FPC VERT 20POS 0.5MM SMD |
0 |
|
规格书 |
IL-FPR | Tray | Obsolete | FPC | Surface Mount | Contacts, Vertical - 1 Sided | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Slide Lock | Tapered | Copper Alloy | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
IL-FPR-32S-HF-N1CONN FPC BOTTOM 32POS 0.5MM R/A |
0 |
|
规格书 |
IL-FPR | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Bottom | 32 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Slide Lock | Tapered | Copper Alloy | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
IL-FPR-36S-VF-N1CONN FPC VERT 36POS 0.5MM SMD |
0 |
|
规格书 |
IL-FPR | Tray | Obsolete | FPC | Surface Mount | Contacts, Vertical - 1 Sided | 36 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Slide Lock | Tapered | Copper Alloy | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
IL-FPR-U10S-HF-N1CONN FPC TOP 10POS 0.5MM R/A |
0 |
|
规格书 |
IL-FPR | Tray | Obsolete | FPC | Surface Mount, Right Angle | Contacts, Top | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Slide Lock | Tapered | Copper Alloy | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |