图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S060T-VFG784IM2S060T-VFG784I Microchip Technology |
60 |
|
![]() 规格书 |
SmartFusion®2 | 784-FBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 784-VFBGA (23x23) |
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M2S060T-1VFG784M2S060T-1VFG784 Microchip Technology |
60 |
|
![]() 规格书 |
SmartFusion®2 | 784-FBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 784-VFBGA (23x23) |
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M2S060TS-VFG784M2S060TS-VFG784 Microchip Technology |
60 |
|
![]() 规格书 |
SmartFusion®2 | 784-FBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 784-VFBGA (23x23) |
![]() |
M2S060T-1VFG784IM2S060T-1VFG784I Microchip Technology |
60 |
|
![]() 规格书 |
SmartFusion®2 | 784-FBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 784-VFBGA (23x23) |
![]() |
M2S060TS-VFG784IM2S060TS-VFG784I Microchip Technology |
60 |
|
![]() 规格书 |
SmartFusion®2 | 784-FBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 784-VFBGA (23x23) |
![]() |
M2S060TS-1VFG784M2S060TS-1VFG784 Microchip Technology |
60 |
|
![]() 规格书 |
SmartFusion®2 | 784-FBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 784-VFBGA (23x23) |
|
M2S090-FGG676IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
82 |
|
![]() 规格书 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
![]() |
M2S060TS-1VFG784IM2S060TS-1VFG784I Microchip Technology |
60 |
|
![]() 规格书 |
SmartFusion®2 | 784-FBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 784-VFBGA (23x23) |
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M2S090TS-1FCS325IIC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology |
599 |
|
![]() 规格书 |
SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 325-FCBGA (11x13.5) |
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M2S150T-1FCG1152IIC SOC CORTEX-M3 166MHZ 1152BGA Microchip Technology |
48 |
|
![]() 规格书 |
SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |