微处理器

    制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 速度 协处理器/DSP RAM 控制器 图形加速 显示和接口控制器 以太网 SATA USB 电压 - I/O 工作温度 等级 认证 安全特性 安装类型 供应商设备封装 附加接口



































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
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    图片 型号 库存 价格 数量 规格书 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 速度 协处理器/DSP RAM 控制器 图形加速 显示和接口控制器 以太网 SATA USB 电压 - I/O 工作温度 等级 认证 安全特性 安装类型 供应商设备封装 附加接口
    IDT79RC64T575-250DP

    IDT79RC64T575-250DP

    IC MPU 250MHZ 208QFP

    Renesas Electronics Corporation

    0
    IDT79RC64T575-250DP

    规格书

    208-BFQFP Exposed Pad - Tray Obsolete MIPS-I 1 Core, 64-Bit 250MHz System Control; CP0 SDRAM No - - - - 2.5V, 3.3V 0°C ~ 85°C (TC) - - - Surface Mount 208-PQFP (28x28) -
    R8A774A3HA01BG#G7

    R8A774A3HA01BG#G7

    SOC RZ/G2M HDMI ON (FULL)

    Renesas Electronics Corporation

    0
    R8A774A3HA01BG#G7

    规格书

    - - Tray Active - - - - - - - - - - - - - - - - - -
    IDT79R4650-133DP

    IDT79R4650-133DP

    IC MPU 133MHZ 208QFP

    Renesas Electronics Corporation

    0
    IDT79R4650-133DP

    规格书

    208-BFQFP Exposed Pad - Tray Obsolete MIPS-I 1 Core, 64-Bit 133MHz System Control; CP0 DRAM No - - - - 5.0V 0°C ~ 85°C (TC) - - - Surface Mount 208-PQFP (28x28) -
    R8A774A1HA01BG#G2

    R8A774A1HA01BG#G2

    IC MCU 32BIT ARM 1022FPBGA

    Renesas Electronics Corporation

    0

    -

    - - Tray Active - - - - - - - - - - - - - - - - - -
    R8A774A3HA01BG#GV

    R8A774A3HA01BG#GV

    SOC RZ/G2M HDMI ON (FULL)

    Renesas Electronics Corporation

    0
    R8A774A3HA01BG#GV

    规格书

    1022-BFBGA, FCBGA RZ/G2M Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 4, 2 Core, 64-Bit 1.2GHz, 1.5GHz ARM® Cortex®-R7 LPDDR4 Yes HMI 10/100/1000Mbps (1) - USB 2.0 OTG (2), USB 3.0 (1) 3.3V -40°C ~ 85°C - - AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Surface Mount 1022-FCBGA (29x29) CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
    IDT79RV4700-133DP

    IDT79RV4700-133DP

    IC MPU 133MHZ 208QFP

    Renesas Electronics Corporation

    0
    IDT79RV4700-133DP

    规格书

    208-BFQFP Exposed Pad - Tray Obsolete MIPS-I 1 Core, 64-Bit 133MHz System Control; CP0 - No - - - - 3.3V 0°C ~ 85°C (TC) - - - Surface Mount 208-PQFP (28x28) -
    R8A774A3HA01BG#U7

    R8A774A3HA01BG#U7

    SOC RZ/G2M HDMI ON (BULK)

    Renesas Electronics Corporation

    0
    R8A774A3HA01BG#U7

    规格书

    - - Tray Active - - - - - - - - - - - - - - - - - -
    R8A774A1HA01BG#U2

    R8A774A1HA01BG#U2

    IC MCU 32BIT ARM 1022FPBGA

    Renesas Electronics Corporation

    0
    R8A774A1HA01BG#U2

    规格书

    - - Tray Active - - - - - - - - - - - - - - - - - -
    R8A774A3HA01BG#UV

    R8A774A3HA01BG#UV

    SOC RZ/G2M HDMI ON (BULK)

    Renesas Electronics Corporation

    0
    R8A774A3HA01BG#UV

    规格书

    1022-BFBGA, FCBGA RZ/G2M Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 4, 2 Core, 64-Bit 1.2GHz, 1.5GHz ARM® Cortex®-R7 LPDDR4 Yes HMI 10/100/1000Mbps (1) - USB 2.0 OTG (2), USB 3.0 (1) 3.3V -40°C ~ 85°C - - AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Surface Mount 1022-FCBGA (29x29) CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
    R8A774E1HA01BN#G0

    R8A774E1HA01BN#G0

    IC MCU 32BIT ARM 1022FPBGA

    Renesas Electronics Corporation

    0

    -

    - - Tray Active - - - - - - - - - - - - - - - - - -
    共 364 条记录«上一页1... 2829303132333435...37下一页»
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