微处理器

    制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 速度 协处理器/DSP RAM 控制器 图形加速 显示和接口控制器 以太网 SATA USB 电压 - I/O 工作温度 等级 认证 安全特性 安装类型 供应商设备封装 附加接口



































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
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    图片 型号 库存 价格 数量 规格书 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 速度 协处理器/DSP RAM 控制器 图形加速 显示和接口控制器 以太网 SATA USB 电压 - I/O 工作温度 等级 认证 安全特性 安装类型 供应商设备封装 附加接口
    R7S921052VCBG#BC0

    R7S921052VCBG#BC0

    IC MPU RZ/A2M 528MHZ 272FBGA

    Renesas Electronics Corporation

    0
    R7S921052VCBG#BC0

    规格书

    272-FBGA RZ/A2M Tray Active ARM® Cortex®-A9 1 Core, 32-Bit 528MHz Multimedia; NEON™ MPE - Yes LCD, LVDS, MIPICSI2, Video - - USB 2.0 (1) - -40°C ~ 85°C (TA) - - AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Surface Mount 272-FBGA (17x17) CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
    R9A07G074M01GBG#AC0

    R9A07G074M01GBG#AC0

    RZ/T2L MPU BGA196 NON-ETHERCAT N

    Renesas Electronics Corporation

    168
    R9A07G074M01GBG#AC0

    规格书

    196-LFBGA RZ/T2L Tray Active ARM® Cortex®-R52 1 Core, 32-Bit 800MHz - SDRAM No - 10/100/1000Mbps (1) - USB 3.0 (2) 3.3V -40°C ~ 125°C (TJ) - - AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Surface Mount 196-LFBGA (12x12) CANbus, DMA, GPIO, I2C, SCI, SPI, USB
    R9A07G044L14GBG#BC0

    R9A07G044L14GBG#BC0

    IC MPU RZ 200MHZ/1.2GHZ 551BGA

    Renesas Electronics Corporation

    0
    R9A07G044L14GBG#BC0

    规格书

    551-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - - Surface Mount 551-LFBGA (21x21) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
    R9A07G044L24GBG#BC0

    R9A07G044L24GBG#BC0

    SOC RZ/G2L 21MMBGA NON-SECUE DUA

    Renesas Electronics Corporation

    0
    R9A07G044L24GBG#BC0

    规格书

    551-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 3 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI-CSI, MIPI-DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - - Surface Mount 551-LFBGA (21x21) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
    R9A07G044L18GBG#BC0

    R9A07G044L18GBG#BC0

    IC MPU RZ 200MHZ/1.2GHZ 551BGA

    Renesas Electronics Corporation

    0
    R9A07G044L18GBG#BC0

    规格书

    551-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Surface Mount 551-LFBGA (21x21) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
    R9A07G044C16GBG#BC0

    R9A07G044C16GBG#BC0

    IC MPU RZ 200MHZ/1.2GHZ 361BGA

    Renesas Electronics Corporation

    952
    R9A07G044C16GBG#BC0

    规格书

    361-LFBGA RZ/G2LC Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Surface Mount 361-BGA (13x13) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
    R9A07G044L13GBG#AC0

    R9A07G044L13GBG#AC0

    IC MPU RZ 200MHZ/1.2GHZ 456BGA

    Renesas Electronics Corporation

    188
    R9A07G044L13GBG#AC0

    规格书

    456-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 2 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - - Surface Mount 456-LFBGA (15x15) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
    R9A07G044L28GBG#BC0

    R9A07G044L28GBG#BC0

    IC MPU RZ 200MHZ/1.2GHZ 551BGA

    Renesas Electronics Corporation

    0
    R9A07G044L28GBG#BC0

    规格书

    551-LFBGA RZ/G2L Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 3 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Surface Mount 551-LFBGA (21x21) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
    R9A07G044C26GBG#BC0

    R9A07G044C26GBG#BC0

    IC MPU RZ 200MHZ/1.2GHZ 361BGA

    Renesas Electronics Corporation

    929
    R9A07G044C26GBG#BC0

    规格书

    361-LFBGA RZ/G2LC Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 3 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Surface Mount 361-BGA (13x13) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
    R9A07G044C26GBG#AC0

    R9A07G044C26GBG#AC0

    IC MPU RZ 200MHZ/1.2GHZ 361BGA

    Renesas Electronics Corporation

    109
    R9A07G044C26GBG#AC0

    规格书

    361-LFBGA RZ/G2LC Tray Active ARM® Cortex®-A55, ARM® Cortex®-M33 3 Core, 64-Bit 200MHz, 1.2GHz ARM® Mali-G31 DDR3L, DDR4 No MIPI/CSI, MIPI/DSI 10/100/1000Mbps (2) - USB 2.0 (2) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Surface Mount 361-BGA (13x13) CANbus, eMMC/SD/SDIO, I2C, SPI, UART
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