微处理器

    制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 速度 协处理器/DSP RAM 控制器 图形加速 显示和接口控制器 以太网 SATA USB 电压 - I/O 工作温度 等级 认证 安全特性 安装类型 供应商设备封装 附加接口



































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 速度 协处理器/DSP RAM 控制器 图形加速 显示和接口控制器 以太网 SATA USB 电压 - I/O 工作温度 等级 认证 安全特性 安装类型 供应商设备封装 附加接口
    X2000

    X2000

    IC MPU 1.2GHZ 270BGA

    Lumissil Microsystems

    1,262
    X2000

    规格书

    270-LFBGA - Tray Active XBurst® 2 - 1.2GHz - LPDDR3 No DVP, LCD, MIPI-CSI, MIPI-DSI 10/100/1000Mbps (1) - USB 2.0 OTG (1) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, TRNG, MD5, SHA, SHA2 Surface Mount 270-BGA (12x12) DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
    X1600E

    X1600E

    LOW-POWER AIOT MICRO-PROCESSOR,

    Lumissil Microsystems

    2,564
    X1600E

    规格书

    159-LFBGA - Tray Active XBurst® 1 1 Core, 32-Bit 1GHz - DDR2, LPDDR2, LVDDR2 No DVP, LCD, MIPI-CSI, RGB 10/100Mbps (1) - USB 2.0 OTG (1) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 Surface Mount 159-BGA (9x9) AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
    X1600

    X1600

    IC MPU 1GHZ 159BGA

    Lumissil Microsystems

    2,600
    X1600

    规格书

    159-LFBGA - Tape & Reel (TR) Active XBurst® 1 1 Core 1GHz - DDR2,LPDDR2 Yes LCD, MIPI-DBI, MIPI-DPI - - USB 2.0 OTG (1) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 Surface Mount 159-BGA (9x9) AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
    X1600HN

    X1600HN

    INTEGRATED APPLICATION PROCESSOR

    Lumissil Microsystems

    0
    X1600HN

    规格书

    159-LFBGA - Tray Active XBurst® 1 1 Core, 32-Bit 1GHz - DDR2 No DVP, LCD, MIPI-CSI, RGB 10/100Mbps (1) - USB 2.0 OTG (1) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA, SHA-2 Surface Mount 159-BGA (9x9) AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
    X2000E

    X2000E

    MULTI-CPU HETEROGENEOUS MULTI-AP

    Lumissil Microsystems

    0
    X2000E

    规格书

    270-TFBGA - Tape & Reel (TR) Active XBurst® 2 2 Core, 32-Bit 1.2GHz - LPDDR3 No LCD, DVP, MIPI-CSI, MIPI-DSI 10/100/1000Mbps (1) - USB 2.0 OTG (1) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, TRNG, MD5, SHA, SHA2 Surface Mount 270-BGA (12x12) DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
    T31ZX

    T31ZX

    IC MPU 1.5GHZ 88QFN

    Lumissil Microsystems

    0
    T31ZX

    规格书

    88-VFQFN Exposed Pad - Tray Active XBurst® 1 1 Core, 32-Bit 1.5GHz Image Signal Processor, Video Processor Unit DDR2 - Smart LCD 10/100Mbps - USB 2.0 OTG (1) 1.5V ~ 3.6V -20°C ~ 85°C (TA) - - DTRNG/RSA/SHA Surface Mount 88-QFN (9x9) I2C, MMC/SD/SDIO, SFC, SMB, SPI, SSI, UART/USART
    X2000H

    X2000H

    MULTI-CPU HETEROGENEOUS MULTI-AP

    Lumissil Microsystems

    0
    X2000H

    规格书

    270-TFBGA - Tape & Reel (TR) Active XBurst® 2 2 Core, 32-Bit 1.2GHz - LPDDR3 No LCD, DVP, MIPI-CSI, MIPI-DSI 10/100/1000Mbps (1) - USB 2.0 OTG (1) 1.8V, 3.3V -40°C ~ 85°C (TA) - - AES, RSA, TRNG, MD5, SHA, SHA2 Surface Mount 270-BGA (12x12) DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
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