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微控制器
| 图片 | 型号 | 库存 | 数量 | 规格书 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MCXA143VFMIC MCX 48MHZ SGL CR 128KB QFN32 NXP USA Inc. |
480 |
|
规格书 |
- | MCX A | Tray | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 48MHz | I2C, I3C, SPI, UART/USART, USB | POR, PWM, WDT | 26 | 128KB (128K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 1x12b; D/A 1x8b | External, Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
MKE14Z64VFP4IC MCU 32BIT 64KB FLASH 40HVQFN NXP USA Inc. |
490 |
|
规格书 |
40-VFQFN Exposed Pad | Kinetis KE1xZ | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | FlexIO, I2C, SPI, UART/USART | DMA, LVD, PWM, WDT | 36 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
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|
MKE12Z128VLF7IC MCU 32BIT 128KB FLASH 48LQFP NXP USA Inc. |
1,250 |
|
规格书 |
48-LQFP | Kinetis KE1xZ | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit | 72MHz | FlexIO, I2C, SPI, UART/USART | DMA, LVD, PWM, WDT | 42 | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MC9S08QE8CFMIC MCU 8BIT 8KB FLASH 32QFN NXP USA Inc. |
2,450 |
|
规格书 |
32-VFQFN Exposed Pad | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SCI, SPI | LVD, PWM, WDT | 26 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MKE14Z64VLD4IC MCU 32BIT 64KB FLASH 44LQFP NXP USA Inc. |
800 |
|
规格书 |
44-LQFP | Kinetis KE1xZ | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 38 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
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S9S08SG8E2MTJRIC MCU 8BIT 8KB FLASH 20TSSOP NXP USA Inc. |
2,720 |
|
规格书 |
20-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
|
MKE14Z64VLF4RMT64P 48LQFP NXP USA Inc. |
2,000 |
|
规格书 |
48-LQFP | Kinetis KE1xZ | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit | 48MHz | FlexIO, I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 42 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 12x12b SAR | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MKE14Z64VLF4IC MCU 32BIT 64KB FLASH 48LQFP NXP USA Inc. |
1,250 |
|
规格书 |
48-LQFP | Kinetis KE1xZ | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 42 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
LPC5512JBD64YIC MCU 32BIT 64KB FLASH 64TQFP NXP USA Inc. |
1,500 |
|
规格书 |
64-TQFP Exposed Pad | LPC551x | Tape & Reel (TR) | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CAN FD, Flexcomm, I2C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | 36 | 64KB (64K x 8) | FLASH | - | 48K x 8 | 1.8V ~ 3.6V | A/D 10x16b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
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LPC5512JBD64KIC MCU 32BIT 64KB FLASH 64TQFP NXP USA Inc. |
800 |
|
规格书 |
64-TQFP Exposed Pad | LPC551x | Tray | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CAN FD, Flexcomm, I2C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | 36 | 64KB (64K x 8) | FLASH | - | 48K x 8 | 1.8V ~ 3.6V | A/D 10x16b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount |
