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微控制器
| 图片 | 型号 | 库存 | 数量 | 规格书 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MKE02Z16VLC4RIC MCU 32BIT 16KB FLASH 32LQFP NXP USA Inc. |
1,740 |
|
规格书 |
32-LQFP | - | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+ | 32-Bit | 40MHz | I2C, SPI, UART/USART | LVD, PWM, WDT | 28 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MKE14Z32VLD4IC MCU 32BIT 32KB FLASH 44LQFP NXP USA Inc. |
800 |
|
规格书 |
44-LQFP | Kinetis KE1xZ | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 38 | 32KB (32K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
MKL02Z8VFG4RIC MCU 32BIT 8KB FLASH 16QFN NXP USA Inc. |
5,000 |
|
规格书 |
16-UFQFN Exposed Pad | Kinetis KL02 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 14 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 1.71V ~ 3.6V | A/D 6x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
MCXC143VFM48MHz, Cortex-M0+ NXP USA Inc. |
455 |
|
规格书 |
32-UFQFN Exposed Pad | MCX C | Tray | Active | - | ARM® Cortex®-M0+ | 32-Bit | 48MHz | I2C, SPI, UART/USART | DMA, PWM, WDT | 28 | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 16b; D/A 1x12b | Internal | -40°C ~ 125°C (TJ) | - | - | Surface Mount | |
|
MKE14Z32VLF4IC MCU 32BIT 32KB FLASH 48LQFP NXP USA Inc. |
1,250 |
|
规格书 |
48-LQFP | Kinetis KE1xZ | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 42 | 32KB (32K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
LPC5502JBD64KIC MCU 32BIT 64KB FLASH 64TQFP NXP USA Inc. |
800 |
|
规格书 |
64-TQFP Exposed Pad | LPC550x | Tray | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 96MHz | CAN FD, Flexcomm, I2C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | 45 | 64KB (64K x 8) | FLASH | - | 48K x 8 | 1.8V ~ 3.6V | A/D 9x16b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MC9S08QB8CWLIC MCU 8BIT 8KB FLASH 28SOIC NXP USA Inc. |
1,040 |
|
规格书 |
28-SOIC (0.295", 7.50mm Width) | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 22 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x12b | External | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MKL02Z16VFG4RIC MCU 32BIT 16KB FLASH 16QFN NXP USA Inc. |
5,000 |
|
规格书 |
16-UFQFN Exposed Pad | Kinetis KL02 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 14 | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 6x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
LPC865M201JBD64/0KIC MCU 32BIT 64KB FLASH 64LQFP NXP USA Inc. |
790 |
|
规格书 |
64-LQFP | LPC86x | Tray | Active | - | ARM® Cortex®-M0+ | 32-Bit | 60MHz | I2C, I3C, SMBus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 54 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 12x12b SAR | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
LPC865M201JBD64/0EIC MCU CORTEX M0+ LQFP64 NXP USA Inc. |
239 |
|
规格书 |
64-LQFP | - | Tray | Active | - | ARM® Cortex®-M0+ | 32-Bit | 60MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 54 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 12x12b SAR | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount |
