现场可编程门阵列(FPGA)

    制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
    M1A3P400-1PQG208I

    M1A3P400-1PQG208I

    IC FPGA 151 I/O 208QFP

    Microchip Technology

    0

    -

    ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
    A3P400-1PQG208I

    A3P400-1PQG208I

    IC FPGA 151 I/O 208QFP

    Microchip Technology

    0
    A3P400-1PQG208I

    规格书

    ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
    A3P600-FG256

    A3P600-FG256

    IC FPGA 177 I/O 256FBGA

    Microchip Technology

    0
    A3P600-FG256

    规格书

    ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
    M1A3P600-FG256

    M1A3P600-FG256

    IC FPGA 177 I/O 256FBGA

    Microchip Technology

    0
    M1A3P600-FG256

    规格书

    ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
    M1A3P600-FGG256

    M1A3P600-FGG256

    IC FPGA 177 I/O 256FBGA

    Microchip Technology

    0
    M1A3P600-FGG256

    规格书

    ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
    M1A3P600-PQG208

    M1A3P600-PQG208

    IC FPGA 154 I/O 208QFP

    Microchip Technology

    0
    M1A3P600-PQG208

    规格书

    ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
    M1A3P600-FGG144I

    M1A3P600-FGG144I

    IC FPGA 97 I/O 144FBGA

    Microchip Technology

    0
    M1A3P600-FGG144I

    规格书

    ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
    M1A3P600-FG144I

    M1A3P600-FG144I

    IC FPGA 97 I/O 144FBGA

    Microchip Technology

    0
    M1A3P600-FG144I

    规格书

    ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
    M2GL025-VF256

    M2GL025-VF256

    IC FPGA 138 I/O 256FBGA

    Microchip Technology

    0
    M2GL025-VF256

    规格书

    IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
    M2GL025-VF400

    M2GL025-VF400

    IC FPGA 207 I/O 400VFBGA

    Microchip Technology

    0
    M2GL025-VF400

    规格书

    IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
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