现场可编程门阵列(FPGA)

    制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
    MPF200T-1FCVG484I

    MPF200T-1FCVG484I

    IC FPGA 284 I/O 484FBGA

    Microchip Technology

    2
    MPF200T-1FCVG484I

    规格书

    PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
    MPF300T-FCG784NE

    MPF300T-FCG784NE

    POLARFIRE MID-RANGE FPGA, 300KLE

    Microchip Technology

    25
    MPF300T-FCG784NE

    规格书

    PolarFire™ 784-BBGA, FCBGA Tray Active - 75000 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
    MPF300T-FCVG484E

    MPF300T-FCVG484E

    IC FPGA 284 I/O 484FCBGA

    Microchip Technology

    2
    MPF300T-FCVG484E

    规格书

    PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 284 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
    MPF300T-1FCG784NE

    MPF300T-1FCG784NE

    POLARFIRE MID-RANGE FPGA, 300KLE

    Microchip Technology

    25
    MPF300T-1FCG784NE

    规格书

    PolarFire™ 784-BBGA, FCBGA Tray Active - 75000 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
    MPF200TLS-FCSG325I

    MPF200TLS-FCSG325I

    IC FPGA 170 I/O 325FPGA

    Microchip Technology

    4
    MPF200TLS-FCSG325I

    规格书

    PolarFire™ 325-LFBGA, FC Tray Active Not Verified - 192000 13619200 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x14.5)
    MPF300T-1FCG784I

    MPF300T-1FCG784I

    IC FPGA 388 I/O 784FCBGA

    Microchip Technology

    2
    MPF300T-1FCG784I

    规格书

    PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
    A54SX72A-2PQG208I

    A54SX72A-2PQG208I

    IC FPGA 171 I/O 208QFP

    Microchip Technology

    24
    A54SX72A-2PQG208I

    规格书

    SX-A 208-BFQFP Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
    MPF200TS-1FCSG536I

    MPF200TS-1FCSG536I

    IC FPGA 300 I/O 536CSPBGA

    Microchip Technology

    10
    MPF200TS-1FCSG536I

    规格书

    PolarFire™ 536-LFBGA, CSPBGA Tray Active Not Verified - 192000 13619200 300 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
    AX1000-FG484I

    AX1000-FG484I

    IC FPGA 317 I/O 484FBGA

    Microchip Technology

    22
    AX1000-FG484I

    规格书

    Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
    AX2000-FG896

    AX2000-FG896

    IC FPGA 586 I/O 896FBGA

    Microchip Technology

    24
    AX2000-FG896

    规格书

    Axcelerator 896-BGA Tray Active Not Verified 32256 - 294912 586 2000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 896-FBGA (31x31)
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