| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | LABs/CLBs 数量 | 逻辑元件/单元数量 | 总 RAM 位数 | I/O 数量 | 门数 | 电压 - 电源 | 安装类型 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A54SX72A-FGG484MIC FPGA 360 I/O 484FBGA Microchip Technology |
0 |
|
规格书 |
SX-A | 484-BGA | Tray | Active | Not Verified | 6036 | - | - | 360 | 108000 | 2.25V ~ 5.25V | Surface Mount | -55°C ~ 125°C (TC) | - | - | 484-FPBGA (27X27) |
|
A54SX72A-FG484MIC FPGA 360 I/O 484FBGA Microchip Technology |
0 |
|
规格书 |
SX-A | 484-BGA | Tray | Active | Not Verified | 6036 | - | - | 360 | 108000 | 2.25V ~ 5.25V | Surface Mount | -55°C ~ 125°C (TC) | - | - | 484-FPBGA (27X27) |
|
APA1000-BGG456IIC FPGA 356 I/O 456BGA Microchip Technology |
0 |
|
规格书 |
ProASICPLUS | 456-BBGA | Tray | Active | Not Verified | - | - | 202752 | 356 | 1000000 | 2.3V ~ 2.7V | Surface Mount | -40°C ~ 85°C (TA) | - | - | 456-PBGA (35x35) |
|
APA1000-BG456IIC FPGA 356 I/O 456BGA Microchip Technology |
0 |
|
规格书 |
ProASICPLUS | 456-BBGA | Tray | Active | Not Verified | - | - | 202752 | 356 | 1000000 | 2.3V ~ 2.7V | Surface Mount | -40°C ~ 85°C (TA) | - | - | 456-PBGA (35x35) |
|
APA1000-FGG896IIC FPGA 642 I/O 896FBGA Microchip Technology |
0 |
|
规格书 |
ProASICPLUS | 896-BGA | Tray | Active | Not Verified | - | - | 202752 | 642 | 1000000 | 2.3V ~ 2.7V | Surface Mount | -40°C ~ 85°C (TA) | - | - | 896-FBGA (31x31) |
|
A54SX72A-1PQG208MIC FPGA 171 I/O 208QFP Microchip Technology |
0 |
|
规格书 |
SX-A | 208-BFQFP | Tray | Active | Not Verified | 6036 | - | - | 171 | 108000 | 2.25V ~ 5.25V | Surface Mount | -55°C ~ 125°C (TC) | - | - | 208-PQFP (28x28) |
|
AX1000-FG676MIC FPGA 418 I/O 676FBGA Microchip Technology |
0 |
|
规格书 |
Axcelerator | 676-BGA | Tray | Active | Not Verified | 18144 | - | 165888 | 418 | 1000000 | 1.425V ~ 1.575V | Surface Mount | -55°C ~ 125°C (TA) | - | - | 676-FBGA (27x27) |
|
|
AX1000-FGG676MIC FPGA 418 I/O 676FBGA Microchip Technology |
0 |
|
规格书 |
Axcelerator | 676-BGA | Tray | Active | Not Verified | 18144 | - | 165888 | 418 | 1000000 | 1.425V ~ 1.575V | Surface Mount | -55°C ~ 125°C (TA) | - | - | 676-FBGA (27x27) |
|
AX1000-FG484MIC FPGA 317 I/O 484FBGA Microchip Technology |
0 |
|
规格书 |
Axcelerator | 484-BGA | Tray | Active | Not Verified | 18144 | - | 165888 | 317 | 1000000 | 1.425V ~ 1.575V | Surface Mount | -55°C ~ 125°C (TA) | - | - | 484-FPBGA (23x23) |
|
AX1000-FGG484MIC FPGA 317 I/O 484FBGA Microchip Technology |
0 |
|
规格书 |
Axcelerator | 484-BGA | Tray | Active | Not Verified | 18144 | - | 165888 | 317 | 1000000 | 1.425V ~ 1.575V | Surface Mount | -55°C ~ 125°C (TA) | - | - | 484-FPBGA (23x23) |