现场可编程门阵列(FPGA)

    制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
    MPF500TS-FCG784I

    MPF500TS-FCG784I

    IC FPGA 388 I/O 784FCBGA

    Microchip Technology

    0
    MPF500TS-FCG784I

    规格书

    PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
    M1AGLE3000V2-FGG484I

    M1AGLE3000V2-FGG484I

    IC FPGA 341 I/O 484FBGA

    Microchip Technology

    0
    M1AGLE3000V2-FGG484I

    规格书

    IGLOOe 484-BGA Tray Active Not Verified - 75264 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
    AGLE3000V2-FGG484I

    AGLE3000V2-FGG484I

    IC FPGA 341 I/O 484FBGA

    Microchip Technology

    0
    AGLE3000V2-FGG484I

    规格书

    IGLOOe 484-BGA Tray Active Not Verified - 75264 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
    M1AGLE3000V2-FG484I

    M1AGLE3000V2-FG484I

    IC FPGA 341 I/O 484FBGA

    Microchip Technology

    0
    M1AGLE3000V2-FG484I

    规格书

    IGLOOe 484-BGA Tray Active Not Verified - 75264 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
    APA600-FG676I

    APA600-FG676I

    IC FPGA 454 I/O 676FBGA

    Microchip Technology

    0
    APA600-FG676I

    规格书

    ProASICPLUS 676-BGA Tray Active Not Verified - - 129024 454 600000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 676-FBGA (27x27)
    APA600-FGG676I

    APA600-FGG676I

    IC FPGA 454 I/O 676FBGA

    Microchip Technology

    0
    APA600-FGG676I

    规格书

    ProASICPLUS 676-BGA Tray Active Not Verified - - 129024 454 600000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 676-FBGA (27x27)
    A42MX16-1PQG160M

    A42MX16-1PQG160M

    IC FPGA 125 I/O 160QFP

    Microchip Technology

    0
    A42MX16-1PQG160M

    规格书

    MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 160-PQFP (28x28)
    A42MX36-PQG208A

    A42MX36-PQG208A

    IC FPGA 176 I/O 208QFP

    Microchip Technology

    0
    A42MX36-PQG208A

    规格书

    MX 208-BFQFP Tray Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 208-PQFP (28x28)
    MPF500TL-FCG1152I

    MPF500TL-FCG1152I

    IC FPGA 584 I/O 1152FCBGA

    Microchip Technology

    0
    MPF500TL-FCG1152I

    规格书

    PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 584 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
    M1A3PE3000L-FGG484I

    M1A3PE3000L-FGG484I

    IC FPGA 341 I/O 484FBGA

    Microchip Technology

    0
    M1A3PE3000L-FGG484I

    规格书

    ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
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