现场可编程门阵列(FPGA)

    制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
    MPF300TLS-FCG784I

    MPF300TLS-FCG784I

    IC FPGA 388 I/O 784FCBGA

    Microchip Technology

    0
    MPF300TLS-FCG784I

    规格书

    PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
    MPF300TS-1FCG784I

    MPF300TS-1FCG784I

    IC FPGA 388 I/O 784FCBGA

    Microchip Technology

    0
    MPF300TS-1FCG784I

    规格书

    PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
    U1AFS1500-FGG256I

    U1AFS1500-FGG256I

    IC FPGA 119 I/O 256FBGA

    Microchip Technology

    0
    U1AFS1500-FGG256I

    规格书

    Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
    U1AFS1500-FG256I

    U1AFS1500-FG256I

    IC FPGA 119 I/O 256FBGA

    Microchip Technology

    0
    U1AFS1500-FG256I

    规格书

    Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
    AX1000-1FGG484

    AX1000-1FGG484

    IC FPGA 317 I/O 484FBGA

    Microchip Technology

    0
    AX1000-1FGG484

    规格书

    Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
    AX1000-1FG484

    AX1000-1FG484

    IC FPGA 317 I/O 484FBGA

    Microchip Technology

    0
    AX1000-1FG484

    规格书

    Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
    AX1000-FGG484I

    AX1000-FGG484I

    IC FPGA 317 I/O 484FBGA

    Microchip Technology

    0
    AX1000-FGG484I

    规格书

    Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
    M1AFS1500-FG484I

    M1AFS1500-FG484I

    IC FPGA 223 I/O 484FBGA

    Microchip Technology

    0
    M1AFS1500-FG484I

    规格书

    Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
    AFS1500-FGG484I

    AFS1500-FGG484I

    IC FPGA 223 I/O 484FBGA

    Microchip Technology

    0
    AFS1500-FGG484I

    规格书

    Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
    M1AFS1500-FGG484I

    M1AFS1500-FGG484I

    IC FPGA 223 I/O 484FBGA

    Microchip Technology

    0
    M1AFS1500-FGG484I

    规格书

    Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
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