上传BOM
D-Sub，D形连接器触点
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 触点类型 | 触点形式 | 线规 | 触点端接 | 触点材料 | 触点表面处理 | 触点表面处理厚度 | 端接表面处理 | 端接表面处理厚度 | 触点尺寸 | 特性 | 等级 | 认证 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1731120824COAX PCB ANGLED CONTACT 50 OHM Molex |
0 |
|
规格书 |
FME, FCT 173112 | Bulk | Active | Coaxial | Female Socket, Right Angle | Machined | - | Solder, PCB | Copper Alloy | Gold | 8.00µin (0.203µm) Inner, 8.00µin (0.203µm) Outer | Gold, Tin | 8.00µin (0.203µm) Inner, 200.0µin (5.08µm) Outer | - | - | - | - |
|
|
1731100403FCT TERM HPWR CRP RCPT 30A WD Molex |
0 |
|
规格书 |
FCT 173110 | Bulk | Active | Power | Female Socket | Machined | 10-12 AWG | Crimp | Copper Alloy | Gold | 31.5µin (0.80µm) | Gold | 7.87µin (0.200µm) | 8 | - | - | - |
|
|
1731120931COAX SOLDER POT CONTACT 75 OHM Molex |
0 |
|
规格书 |
FMX, FCT 173112 | Bulk | Active | Coaxial | Male Pin | Machined | RG-179, 187 | Crimp and Solder | Copper Alloy | Gold | 8.00µin (0.203µm) Inner, 8.00µin (0.203µm) Outer | Gold, Tin | 8.00µin (0.203µm) Inner, 200.0µin (5.08µm) Outer | - | - | - | - |
|
|
1731120621FCT TERM HFREQ CRP RCPT 75 OHM D Molex |
0 |
|
规格书 |
FCT 173112 | Bulk | Active | Coaxial | Female Socket | Machined | RG-179, 187 | Solder | Copper Alloy | Gold | 19.7µin (0.50µm) | Tin | 196.8µin (5.00µm) | 8 | - | - | - |
|
|
1731121106FCT TERM HFREQ RA PC RCPT 50 OHM Molex |
0 |
|
规格书 |
FCT 173112 | Bulk | Active | Coaxial | Female Socket, Right Angle | Machined | - | Solder | Copper Alloy | Gold | 8.00µin (0.203µm) | Tin | 196.8µin (5.00µm) | 8 | - | - | - |
|
|
1731120181CONN D-SUB SOCKET COAX CRIMP Molex |
0 |
|
规格书 |
FMS, FCT 173112 | Bulk | Active | Coaxial | Female Socket | Machined | RG-180 | Crimp | Copper Alloy | Gold | 51.2µin (1.30µm) Inner, 31.5µin (0.80µm) Outer | Gold | 51.2µin (1.30µm) Inner, 8.00µin (0.203µm) Outer | - | - | - | - |
|
|
1731120816COAX PCB ANGLED CONTACT 75 OHM Molex |
0 |
|
规格书 |
FME, FCT 173112 | Bulk | Active | Coaxial | Male Pin, Right Angle | Machined | - | Solder, PCB | Copper Alloy | Gold | 8.00µin (0.203µm) Inner, 8.00µin (0.203µm) Outer | Gold, Tin | 8.00µin (0.203µm) Inner, 200.0µin (5.08µm) Outer | - | - | - | - |
|
|
1731120620FCT TERM HFREQ CRP PLG 75 OHM DI Molex |
0 |
|
规格书 |
FCT 173112 | Bulk | Active | Coaxial | Male Pin | Machined | RG-179, 187 | Solder | Copper Alloy | Gold | 19.7µin (0.50µm) | Tin | 196.8µin (5.00µm) | 8 | - | - | - |
|
|
1731120790FCT TERM HFREQ Molex |
0 |
|
规格书 |
FCT 173112 | Bulk | Active | Coaxial | Male Pin | Machined | RG-174, 188, 316 | Solder | Copper Alloy | Gold | 51.2µin (1.30µm) | Gold | 7.87µin (0.200µm) | 8 | - | - | - |
|
|
1731120180CONN D-SUB PIN COAX CRIMP GOLD Molex |
0 |
|
规格书 |
FMS, FCT 173112 | Bulk | Active | Coaxial | Male Pin | Machined | RG-180 | Crimp | Copper Alloy | Gold | 51.2µin (1.30µm) Inner, 31.5µin (0.80µm) Outer | Gold | 51.2µin (1.30µm) Inner, 8.00µin (0.203µm) Outer | - | - | - | - |
