图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 锁相环(PLL) | 主要用途 | 输入 | 输出 | 电路数量 | 输入:输出比 | 差分 - 输入:输出 | 最大频率 | 电压 - 电源 | 工作温度 | 安装类型 | 等级 | 认证 | 供应商设备封装 |
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ZL30153GGG2IC DPLL NETWORK SYNCH 100FBGA Microchip Technology |
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![]() 规格书 |
- | 100-LBGA | Tray | Active | Not Verified | Yes | Ethernet, SONET/SDH, Stratum | Clock | LVCMOS, LVPECL | 1 | 4:12 | Yes/Yes | 750MHz | - | -40°C ~ 85°C | Surface Mount | - | - | 100-LBGA (11x11) |
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ZL30161GDG2IC CLK TRANSLATOR 1CH 144LBGA Microchip Technology |
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![]() 规格书 |
- | 144-BGA | Tray | Active | Not Verified | Yes | Ethernet, Fibre Channel, SONET/SDH | Clock | LVCMOS, LVPECL | 1 | 11:12 | Yes/Yes | 750MHz | - | -40°C ~ 85°C | Surface Mount | - | - | 144-LBGA (13x13) |
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ZL30162GDG2IC CLK TRANSLATOR 4CH 144LBGA Microchip Technology |
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![]() 规格书 |
- | 144-BGA | Tray | Active | Not Verified | Yes | Ethernet, Fibre Channel, SONET/SDH | Clock | LVCMOS, LVPECL | 1 | 11:16 | Yes/Yes | 750MHz | - | -40°C ~ 85°C | Surface Mount | - | - | 144-LBGA (13x13) |
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ZL30310GKG2IC TIMING-OVER-PACKET 256TEBGA-2 Microchip Technology |
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![]() 规格书 |
- | 256-BGA | Tray | Active | Not Verified | Yes | Ethernet | Clock | Clock | 1 | 11:8 | No/No | 125MHz | - | -40°C ~ 85°C | Surface Mount | - | - | 256-BGA (17x17) |
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ZL30314GKG2IC TIMING-OVER-PACKET 256TEBGA-2 Microchip Technology |
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![]() 规格书 |
- | 256-BGA | Tray | Active | Not Verified | Yes | Ethernet, Stratum | Clock | Clock | 1 | 11:8 | No/No | 125MHz | - | -40°C ~ 85°C | Surface Mount | - | - | 256-BGA (17x17) |
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ZL30342GGG2IC SYNCE/SONET/SDH 144CABGA Microchip Technology |
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![]() 规格书 |
- | 64-BGA | Tray | Active | Not Verified | Yes | Ethernet, SONET/SDH, Stratum, Telecom | Clock | Clock | 1 | 6:4 | No/Yes | 622.08MHz | - | -40°C ~ 85°C | Surface Mount | - | - | 64-LBGA (9x9) |
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ZL30407QCG1IC PLL SONET/SDH CLK MULT 80LQFP Microchip Technology |
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![]() 规格书 |
- | 80-LQFP | Tray | Obsolete | Not Verified | Yes | SONET/SDH, Stratum | Clock | CMOS, LVDS | 1 | 2:12 | No/No | 155.52MHz | 3V ~ 3.6V | -40°C ~ 85°C | Surface Mount | - | - | 80-LQFP (14x14) |
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DSC557-0333FE0TMEMS OSC XO 100.0000MHZ LVDS SMD Microchip Technology |
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![]() 规格书 |
DSC557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Yes | PCI Express (PCIe) | - | LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -20°C ~ 70°C | Surface Mount | - | - | - |
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DSC557-0333FI0MEMS OSC XO 100.0000MHZ LVDS SMD Microchip Technology |
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![]() 规格书 |
DSC557-03 | 14-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | PCI Express (PCIe) | - | LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount | - | - | - |
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DSC557-0333FI0TMEMS OSC XO 100.0000MHZ LVDS SMD Microchip Technology |
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![]() 规格书 |
DSC557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Yes | PCI Express (PCIe) | - | LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount | - | - | - |