图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 卡片类型 | 性别 | 位置数/每槽/每行 | 位置数量 | 卡片厚度 | 行数 | 间距 | 读出方式 | 特性 | 安装类型 | 端接方式 | 触点材料 | 触点表面处理 | 触点表面处理厚度 | 触点类型 | 颜色 | 法兰特性 | 工作温度 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
MEC8-140-02-L-D-RA1-TRCONN EDGE DUAL FMALE 80POS 0.031 Samtec Inc. |
173 |
|
![]() 规格书 |
MEC8 - RA | Tape & Reel (TR) | Active | Non Specified - Dual Edge | Female | - | 80 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount, Right Angle | Solder | Phosphor Bronze | Gold | 10.0µin (0.25µm) | Hairpin Bellows | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-130-01-L-PV-2-1CONN EDGE DUAL FML 62POS 0.031 Samtec Inc. |
197 |
|
![]() 规格书 |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 30; 2 | 62 (60 + 2 Power) | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount, Through Hole | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-150-01-L-DV-A-BLCONN EDGE DUAL FML 100POS 0.031 Samtec Inc. |
0 |
|
![]() 规格书 |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 50 | 100 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Board Lock | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-132-01-L-DP-A-KCONN PCI EXP FMALE 64POS 0.031 Samtec Inc. |
341 |
|
![]() 规格书 |
Edge Rate™ HSEC8 | Tape & Reel (TR) | Active | PCI Express™ | Female | - | 64 | 0.063" (1.60mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Pick and Place | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-116-01-L-DP-A-KCONN PCI EXP FMALE 32POS 0.031 Samtec Inc. |
405 |
|
![]() 规格书 |
Edge Rate™ HSEC8 | Tape & Reel (TR) | Active | PCI Express™ | Female | - | 32 | 0.063" (1.60mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Pick and Place | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
MEC8-120-02-S-D-RA1-TRCONN EDGE DUAL FMALE 40POS 0.031 Samtec Inc. |
225 |
|
![]() 规格书 |
MEC8 - RA | Tape & Reel (TR) | Active | Non Specified - Dual Edge | Female | - | 40 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount | Solder | Phosphor Bronze | Gold | 30.0µin (0.76µm) | Hairpin Bellows | Black | - | -55°C ~ 125°C |
![]() |
MEC8-120-01-S-D-RA1-TRCONN EDGE DUAL FMALE 40POS 0.031 Samtec Inc. |
161 |
|
![]() 规格书 |
MEC8 - RA | Tape & Reel (TR) | Active | Non Specified - Dual Edge | Female | - | 40 | 0.039" (1.00mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount, Right Angle | Solder | Phosphor Bronze | Gold | 30.0µin (0.76µm) | Hairpin Bellows | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-190-01-S-DV-A-KCONN EDGE DUAL FML 180POS 0.031 Samtec Inc. |
466 |
|
![]() 规格书 |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 90 | 180 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-120-01-L-DP-A-WT-KCONN PCI EXP FMALE 40POS 0.031 Samtec Inc. |
245 |
|
![]() 规格书 |
Edge Rate™ HSEC8 | Tape & Reel (TR) | Active | PCI Express™ | Female | - | 40 | 0.063" (1.60mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Pick and Place, Solder Retention | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
|
MEC6-120-02-L-D-RA1CONN EDGE DUAL FMALE 40POS 0.025 Samtec Inc. |
24 |
|
![]() 规格书 |
MEC6 - RA | Tray | Active | Non Specified - Dual Edge | Female | 20 | 40 | 0.062" (1.57mm) | 2 | 0.025" (0.64mm) | Dual | Board Guide | Surface Mount, Right Angle | Solder | Phosphor Bronze | Gold | 10.0µin (0.25µm) | - | Black | - | -55°C ~ 125°C |