| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 卡片类型 | 性别 | 位置数/每槽/每行 | 位置数量 | 卡片厚度 | 行数 | 间距 | 读出方式 | 特性 | 安装类型 | 端接方式 | 触点材料 | 触点表面处理 | 触点表面处理厚度 | 触点类型 | 颜色 | 法兰特性 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MEC1-170-02-S-D-RA2-SLCONN EDGE DUAL FML 140POS 0.039 Samtec Inc. |
0 |
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MEC1 | Tube | Active | Non Specified - Dual Edge | Female | - | 140 | 0.062" (1.57mm) | 2 | 0.039" (1.00mm) | Dual | Board Lock | Surface Mount, Right Angle | Solder | Phosphor Bronze | Gold | 30.0µin (0.76µm) | Loop Bellows | Black | - | -55°C ~ 125°C |
|
MEC1-170-02-SM-D-RA1-SL1.00 MM MINI EDGE CARD SOCKET, V Samtec Inc. |
0 |
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规格书 |
MEC1 | Tube | Active | Non Specified - Dual Edge | Female | - | 140 | 0.062" (1.57mm) | 2 | 0.039" (1.00mm) | Dual | - | Surface Mount, Right Angle | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Loop Bellows | Black | - | -55°C ~ 125°C |
|
HSC8-060-02-19-DP0.80 MM HIGH-SPEED RISER CARD Samtec Inc. |
0 |
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规格书 |
HSC8 | Bulk | Active | Fits Female Edgecards | Male | - | 60 | 0.062" (1.57mm) | - | 0.031" (0.80mm) | - | - | - | - | Copper | Gold | - | - | - | - | - |
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HSC8-060-02-19-SE0.80 MM HIGH-SPEED RISER CARD Samtec Inc. |
0 |
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规格书 |
HSC8 | Bulk | Active | Fits Female Edgecards | Male | - | 60 | 0.062" (1.57mm) | - | 0.031" (0.80mm) | - | - | - | - | Copper | Gold | - | - | - | - | - |
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HSEC8-149-01-S-D-EM2LCONN EDGE DUAL FMALE 98POS 0.031 Samtec Inc. |
0 |
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规格书 |
Edge Rate™ HSEC8 | Tube | Active | Non Specified - Dual Edge | Female | 49 | 98 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Solder Retention | Board Edge, Straddle Mount | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Cantilever | Black | - | -55°C ~ 125°C |
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HSEC8-180-01-L-DV-A-WTCONN EDGE DUAL FML 160POS 0.031 Samtec Inc. |
0 |
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规格书 |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 80 | 160 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Solder Retention | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
|
HSEC8-120-01-L-RA-BL0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc. |
0 |
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规格书 |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 20 | 40 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Lock | Surface Mount, Right Angle | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
|
HSC8-040-02-25-SE0.80 MM HIGH-SPEED RISER CARD Samtec Inc. |
0 |
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规格书 |
HSC8 | Bulk | Active | Fits Female Edgecards | Male | - | 40 | 0.062" (1.57mm) | - | 0.031" (0.80mm) | - | - | - | - | Copper | Gold | - | - | - | - | - |
|
HSC8-040-02-25-DP0.80 MM HIGH-SPEED RISER CARD Samtec Inc. |
0 |
|
规格书 |
HSC8 | Bulk | Active | Fits Female Edgecards | Male | - | 40 | 0.062" (1.57mm) | - | 0.031" (0.80mm) | - | - | - | - | Copper | Gold | - | - | - | - | - |
|
HTEC8-1100-01-L-DV0.80 MM RUGGED HIGH-SPEED EDGE C Samtec Inc. |
0 |
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规格书 |
Edge Rate™ HTEC8 | Tray | Active | PCI Express™ | Female | 100 | 200 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | - | Surface Mount | Solder | Copper Alloy | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |